Electronics

Nonlinear Finite Element Simulation of Wire Bonding by Capillary Compression

This nonlinear finite element simulation was set up to model a segment of gold wire, used in semiconductor applications, as it is bonded at the end of a wire loop by a capillary through which the wire is fed. First, the wire was bent to account for the deformation and residual stress state of this section of wire prior to the squeezing action of the capillary.

After the wire was bent, the capillary, modeled as a rigid surface, was displaced toward the bond surface thereby coining the wire segment. The model of the bonding process included nonlinear effects such as: large deformation, large strain, nonlinear material behavior (plasticity), and contact (including friction).